The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Feb. 21, 2001
Applicant:
Inventors:
Akira Nagai, Hitachi, JP;
Masayuki Noda, Hikone, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ; C08L 8/308 ;
U.S. Cl.
CPC ...
B32B 3/00 ; C08L 8/308 ;
Abstract
A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300° C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.
Nagai, Akira. (2002). Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound (U.S. Patent No. 6489013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6489013
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile