The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Oct. 27, 2000
Tsuyoshi Arai, Kariya, JP;
Isao Makino, Chiryu, JP;
Eiji Mimura, Okazaki, JP;
Hisashi Kayano, Toyoake, JP;
Denso Corporation, Kariya, JP;
Abstract
A first compact ( ) is molded by injection according to the MIM method in which a molding material composed of a mixture of metal powder and a binder is injected into a die for molding, after which a second compact ( ) is molded by injection in close contact with the joining surface ( ) of the first compact ( ) thereby to fabricate a metal composite compact ( ). The second compact ( ) is molded by injection by making it flow and fill a die ( ) in such a manner as to obtain a flow component (R) in the direction parallel to the joining surface ( ) of the first compact ( ) on the same joining surface ( ). In a method according to another embodiment, cavity surfaces ( ) formed on a reference die ( ) and a first replacement die ( ), respectively, are placed in opposed relation to each other thereby to form a first cavity ( ), in which the first compact ( ) is molded by injection. Then, while leaving the first compact ( ) in the cavity surface ( ) of the reference die ( ), only the first replacement die ( ) is replaced by a second replacement die ( ) having a cavity surface ( ) of a different shape thereby to form a second cavity ( ), into which the second compact ( ) is molded by injection.