The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2002

Filed:

Aug. 27, 1999
Applicant:
Inventors:

Akira Tanahashi, Okazaki, JP;

Norihisa Imaizumi, Hoi-gun, JP;

Seiji Shibata, Iruma, JP;

Eiichi Sudo, Aichi-gun, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/522 ; C23L 1/800 ; C23L 3/000 ;
U.S. Cl.
CPC ...
B23K 3/522 ; C23L 1/800 ; C23L 3/000 ;
Abstract

Soldering paste for bonding an electronic component to electrodes on a ceramic substrate includes alcohol having at least two OH groups, organic acid, and metallic powder. The electronic component disposed on the electrodes through the soldering paste undergoes a reflow performed in a nitrogen atmosphere. Accordingly, an ester film is formed around the electrodes as a reaction product of the organic acid and the alcohol. The ester film incorporates therein the remaining organic acid and metal salt as its reaction product. As a result, high insulation reliability is provided.


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