The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Jul. 19, 2000
Hsu-Pin Wang, Tallahassee, FL (US);
Qing Liu, Tallahassee, FL (US);
Florida State University, Tallahassee, FL (US);
Abstract
An apparatus for planarizing semiconductor wafers in a chemical-mechanical planarization process comprises a polishing pad, a wafer carrier, and at least one acoustic sensor for receiving acoustic emissions produced during the chemical-mechanical planarization process. The wafer carrier is positioned adjacent the polishing pad and is adapted for carrying a wafer in a manner so that the wafer engages the polishing pad. The wafer carrier and the polishing pad are moveable relative to one another in a manner to planarize the wafer. The acoustic sensor is mounted to the wafer carrier in a manner so that the sensor is in contact with the wafer. The acoustic sensor receives acoustic emissions produced during a chemical-mechanical planarization process. The received acoustic emissions are then analyzed to identify and determine surface characteristics of the wafer.