The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Jul. 01, 1999
Applicant:
Inventors:
Douglas E. Chrzanowski, Owego, NY (US);
John A. Welsh, Easley, SC (US);
James W. Wilson, Vestal, NY (US);
Jeffrey A. Zimmerman, Manassas, VA (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ;
Abstract
A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is supported upon a closed woven, fiberglass mesh, which supports the circuit pad during the bonding process.
Chrzanowski, Douglas. (2002). Wire bonding method and apparatus (U.S. Patent No. 6488198). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6488198
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile