The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Jun. 21, 2000
Katsumasa Miyazaki, Hitachi, JP;
Satoru Aoike, Hitachi, JP;
Satoshi Kanno, Hitachi, JP;
Masakazu Hisatsune, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a thickness reducing management for pipes in pipe lines, limited proper parameters which cause erosion and corrosion of the pipes are selected and with these parameters a pipe thickness reducing speed evaluation model formulas are constructed, and by making use of the model formulas thickness reducing amount of the pipes is evaluated. Thereby, conventional difficulty of formulating a proper pipe thickness reducing estimation model formula in view of actual pipe material and pipe inner fluid state because of too many possibly influential parameters causing pipe thickness reducing due to erosion and corrosion, and conventional difficulty of performing highly reliable pipe thickness reducing management are overcome.