The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Jul. 18, 2000
John Michael Sedlak, Shreveport, LA (US);
General Electric Company, Schenectady, NY (US);
Abstract
A method for determining optimum enamel die sizes for each of a plurality of dies for fabricating magnet wire includes a series of calculations based upon an empirically determined build factor for each of the enamel coatings used in the fabrication process. The build factor is a measure of the effective diameter increase of a wire passed through a coating die when the diameter of the wire entering the die is known and a selected thickness of wet enamel coating exiting the die is known. The build factor a given enamel coating is primarily dependent upon only the solids content of the enamel coating solution, and is largely independent of the chemistry of the coating solution. A simple relationship between build factor, die size, and wire size allows consistent fabrication of magnet wire in accordance with pre-selected specifications and with virtually no scrapped wire due to oversized final wire diameters.