The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Jun. 07, 2000
Kaneyuki Kato, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A circuit device with a ball grid array (BGA) package structure includes an interposer substrate, at least a flip chip, a unitary mold resin and a heat spreader. The interposer substrate has a plurality of first connecting pads arrayed on an upper surface thereof in a first density. The flip chip has a plurality of second connecting pads arrayed on a lower surface thereof in the first density, and is mounted on the interposer substrate via solder bumps for connecting the plurality of first connecting pads and the plurality of second connecting pads. The unitary mold resin fills a space between the lower surface of the flip chip and the upper surface of the interposer substrate and peripheral portions of the flip chip on the upper surface of the interposer substrate. The heat spreader has a lower surface directly coupled to an upper surface of the flip chip with a metal paste and coupled to upper surfaces of the peripheral portions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile