The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Jun. 29, 1999
Kazuhisa Sato, Aichi, JP;
Hiroyuki Hashimoto, Aichi, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A wired board comprises a plurality of bonding pads for connection to connecting terminals of an electronic part, and a plurality of external connection terminals for connection to connecting terminals of an external circuit board such as a motherboard. Each of the bonding pads has a metallized layer, and further has a Ni—B-plated layer, a Ni—P-plated layer and a Au-plated layer which are formed in this order on the metallized layer. The Au-plated layer has the thickness ranging from 1.2 to 3.5 &mgr;m. Each of the external connection terminals has a metallized layer, and further has a Ni—B-plated layer and a Au-plated layer which are formed in this order on the metallized layer of each of the external connection terminals. The Au-plated layer of each of the external connection terminals has the thickness ranging from 0.01 to 1 &mgr;m. A method of producing the wired board is also provided.