The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Apr. 20, 2000
Kinya Nakatsu, Hitachi, JP;
Toshio Ogawa, Hitachinaka, JP;
Akihiro Tamba, Hitachi, JP;
Hiroshi Fujii, Chiba, JP;
Hiroyuki Tomita, Funabashi, JP;
Norinaga Suzuki, Sakura, JP;
Kazuhiro Ito, Chiba, JP;
Masahiro Hiraga, Yotsukaido, JP;
Other;
Abstract
A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor element mounted thereon by an adhesive, and the like in a similar manner as the module case. According to the present invention, an electrode can be disposed in an appropriate position in the semiconductor module, and the scope of the free layout is enhanced.