The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2002

Filed:

Mar. 30, 2001
Applicant:
Inventor:

Tomonori Seki, Kyoto, JP;

Assignee:

Omron Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 5/700 ; H01H 5/122 ; H01L 2/996 ;
U.S. Cl.
CPC ...
H01H 5/700 ; H01H 5/122 ; H01L 2/996 ;
Abstract

An electrostatic microrelay is disclosed. The electrostatic microrelay includes a fixed substrate having a fixed electrode and a fixed terminal on its upper surface and a moveable substrate having a moveable electrode and a moveable terminal on its lower surface. The moveable substrate is elastically supported by a support member that is disposed between the fixed substrate and the moveable substrate in a manner that the lower surface of the moveable substrate faces the upper surface of the fixed substrate at a certain distance. A protrusion is provided on the upper surface of the fixed substrate or the lower surface of the moveable substrate. The protrusion has a certain height. Upon applying voltage between the moveable electrode and the fixed electrode, the moveable electrode is attracted to the fixed electrode such that the protrusion provided on the upper surface of the fixed substrate or the lower surface of the moveable substrate contacts the other substrate and the moveable terminal elastically contacts the fixed terminal to close the microrelay in this order. Also, upon releasing the voltage from the electrode, the moveable terminal becomes reliably separated from the fixed terminal by a repulsive elastic force caused by the contact between the protrusion and the other substrate.


Find Patent Forward Citations

Seki, Tomonori. (2002). Electrostatic microrelay (U.S. Patent No. 6486425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6486425

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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