The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2002

Filed:

Jan. 24, 2000
Applicant:
Inventors:

Roger D. Wustman, Loveland, OH (US);

Jeffrey A. Conner, Hamilton, OH (US);

Jonathan P. Clarke, West Chester, OH (US);

Timothy L. Norris, Hamilton, OH (US);

William E. Brummett, II, Clay, KY (US);

Thomas E. Mantkowski, Madeira, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 1/504 ; F03B 3/12 ;
U.S. Cl.
CPC ...
B32B 1/504 ; F03B 3/12 ;
Abstract

A thermal barrier coating (TBC) system and method for forming the TBC system on a component designed for use in a hostile thermal environment, such as superalloy turbine, combustor and augmentor components of a gas turbine engine. The TBC system exhibits improved spallation resistance as a result of having a bond coat formed to contain a dispersion of oxide particles in its outer surface region. A method for preferentially entrapping oxide particles in a bond coat entails depositing the oxide particles on the surface of the component prior to forming the bond coat, which may be a diffusion aluminide or an aluminized overlay coating. Deposition of the bond coat causes the oxide particles to become dispersed in the outer surface region of the bond coat. A particular feature of this invention is the ability to preferentially entrap oxides of elements that are not present in the bond coat or a substrate region of the component on which the bond coat is formed.


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