The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Sep. 28, 2001
Applicant:
Inventor:
Mohammad Eslamy, Milpitas, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 ; H01L 2/348 ;
U.S. Cl.
CPC ...
B22F 7/00 ; H01L 2/348 ;
Abstract
A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printed circuit board warping caused by the mismatch in the coefficients of thermal expansion between the conventional solder mask and the printed circuit board. A native nickel-oxide layer that forms on the surface of the exposed portions of the plated nickel layer functions as a solder dam.