The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Feb. 25, 2000
Kiyokazu Moriizumi, Kawasaki, JP;
Mikio Nishihara, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
To provide electrical conduction between front and back surfaces of a thin film multi-layered circuit board, such as an MCM, at low cost without using a simultaneous firing process for ceramic. The thin film multi-layered circuit board has at least one thin film circuit layer on a first surface of a substrate, wherein a conductor layer is disposed in the lowermost layer of the thin film circuit layer in contact with the first surface of the substrate, and is characterized in that holes for providing the electrical conduction between front and back surfaces of the substrate are formed through the substrate from the first surface to a second surface thereof so that the conductor layer is exposed in the hole, wherein the diameter of the hole is gradually enlarged from the first surface to the second surface.