The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Dec. 17, 2001
Applicant:
Assignee:
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/200 ;
U.S. Cl.
CPC ...
H01R 1/200 ;
Abstract
A BGA socket ( ) comprises a base ( ) defining a plurality of contact passageways ( ), a plurality of contacts ( ) received in the contact passageways, and a cover ( ) movably mounted on the base. Each contact has a fitting portion ( ) fixedly engaging with the base, a contact portion ( ) formed above the fitting portion for engaging with a pin of an IC module, and a contact pad ( ) below the fitting portion for being soldered to a printed circuit board. The bottom surface ( ) of the contact pad has a plurality of bumps ( ). A solder ball ( ) is soldered to the bottom surface of the contact pad and bonded with the bumps.