The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Mar. 09, 2001
Masato Sakao, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate, a first interlayer dielectric film covering the semiconductor substrate, a second interlayer dielectric film covering the first interlayer dielectric, an opening having an upper-layer opening penetrating the second interlayer dielectric film, and a lower-layer opening penetrating the first interlayer dielectric film down to the surface of the semiconductor substrate and being connected to the upper-layer opening. The lower-layer opening being arranged such that diameter of the lower-layer reduces gradually from the upper-layer opening toward the semiconductor substrate. A conductive film covering at least the bottom surface of the lower-layer opening and side walls of the lower-layer and upper-layer openings.