The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Jun. 29, 2001
Applicant:
Inventor:
Shunichi Tokitoh, Kanagawa, JP;
Assignee:
OKI Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/14763 ; H01L 2/144 ;
Abstract
A method for polishing a semiconductor wafer, includes the steps of supplying a polishing slurry between a polishing pad and a semiconductor wafer; polishing a surface of the semiconductor wafer with the polishing pad in a CMP process; and controlling the temperature of the polishing slurry to be in a range between 2° C. to 10° C. while the semiconductor wafer is polished.
Quick Actions:
Tokitoh, Shunichi. (2002). Method and apparatus for polishing semiconductor wafer (U.S. Patent No. 6482732). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6482732
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile