The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Mar. 29, 1999
Applicant:
Inventors:
Yukihiro Morikawa, Yokohama, JP;
Hiroyoshi Yano, Yokohama, JP;
Ichiro Higashikubo, Yokohama, JP;
Toshiaki Sasahara, Yokohama, JP;
Assignee:
Nippon Polyurethane Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/700 ; B32B 2/740 ;
U.S. Cl.
CPC ...
B32B 2/700 ; B32B 2/740 ;
Abstract
An adhesive for lamination which comprises a resin whose dynamic wettability to a film substrate is at least 0.20 mN alone or in combination with a polyisocyanate curing agent, said adhesive for lamination having a good adhesiveness to a film substrate such as a plastic film, a metal foil, a metallized film or paper.
Morikawa, Yukihiro. (2002). Adhesive for lamination (U.S. Patent No. 6482523). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6482523
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile