The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Jan. 27, 2000
Applicant:
Inventors:
Shigenobu Fukui, Tokyo, JP;
Mikio Nishijima, Tokyo, JP;
Hiroyuki Suzuki, Tokyo, JP;
Hiroyuki Kohno, Tokyo, JP;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 3/300 ;
U.S. Cl.
CPC ...
B29C 3/300 ;
Abstract
In a method for evaluation of abrasion of a forming mold, abrasion amounts of divided pieces which are divided from a mold piece constituting a cavity are measured with the divided pieces removed or not removed from a forming mold body. A layer, a marking-off line or satin is formed on the surfaces of the divided pieces, which are observed visually every predetermined shot to judge a degree of abrasion of the respective divided pieces.