The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
May. 22, 2000
Schelto Van Doorn, San Jose, CA (US);
Infineon Technologies North America Corp., San Jose, CA (US);
Abstract
EMI-shielding strain relief boots and dust covers and methods of using these boots and dust covers are described. An inventive EMI-shielding strain relief boot includes a flexible elongated boot body and an EMI shield. The boot body has a proximal end, a distal end, and an inner surface defining a bore sized and arranged to contain an end portion of a transmission cable and an associated cable connector. The EMI shield extends along a substantial length of the boot body and is configured to shield a region of the bore from interfering electromagnetic radiation. The distal end of the boot body is slidable over the cable connector and is conformable to and envelopable about at least a portion of a pluggable transceiver connector. The dust cover has a flexible elongated dust cover body and an EMI shield. An inventive EMI-shielding dust cover body has a proximal end, a distal end, and an inner surface defining a bore sized and arranged to contain a flange protruding from an opening in an electronic apparatus enclosure. The EMI shield extends along a substantial length of the dust cover body and is configured to shield a region of the bore from interfering electromagnetic radiation. The distal end of the dust cover body is conformable to and envelopable about the flange protruding from the opening in the electronic apparatus enclosure.