Device for establishing optimal material flow rate for unloading materials

Abstract

A device for establishing an optimal material flow rate through a material convey line in which a pressurized fluid flow is used to convey material entrained within the fluid passed through the convey line is disclosed. The device includes a plate defining an orifice therein, and a latching mechanism for detachably connecting the plate to an o discharge opening of the material convey line. A gasket is disposed on a first side of the plate and extends along the periphery thereof, and is adapted to be received on and sealed to the discharge end of the material convey line when connected thereto by the latching mechanism such that the fluid flow may pass through only the orifice within the plate. The orifice is sized and shaped to establish a fluid flow backpressure within the material convey line, when the plate is connected to the material convey line, which equates generally to the transport of material therethrough for optimizing the fluid flow parameters within the material convey line without having to otherwise pass the entrained materials therethrough. The device also includes an elongate tubular body having a first end and a spaced second end, the orifice plate being affixed along its first side to the second end of the tubular body.