The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2002
Filed:
Jul. 15, 1999
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 1/918 ;
U.S. Cl.
CPC ...
G05B 1/918 ;
Abstract
High-speed high-reliability component supplying method and mounting method is obtained by checking whether or not a component is the regular component to be mounted through a component type detecting process by means of component arrangement data having a plurality of substitute component type names of components which can be mounted in the proper position of a component supply section and a detection section and a comparing and deciding process.
Kuribayashi, Takeshi. (2002). Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods (U.S. Patent No. 6480751). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6480751
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile