The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2002

Filed:

May. 04, 2001
Applicant:
Inventor:

Motoyasu Nakanishi, Shizuoka, JP;

Assignee:

Suzuki Sogyo Co., Ltd., Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/500 ;
U.S. Cl.
CPC ...
B32B 1/500 ;
Abstract

An object is to provide a metal-clad laminated board applicable for a printed wiring board capable of readily dissipating heat and superior in thermal conduction, and further, the printed wiring board substrate overlaid with a lead frame having the same characteristics as the metal-clad laminated board. To attain the aforesaid object, the printed wiring board of the invention has the carbon-base substrate overlaid with metal foil or lead frame through an insulating bonding layer. Thus, in a case of using the metal foil, the printed wiring board is formed in a metal-clad laminated board, and in a case of using the lead frame, the printed wiring board is formed in a lead frame laminated board.


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