The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2002

Filed:

Jun. 24, 1999
Applicant:
Inventors:

Yoshihiro Ikefuji, Kyoto, JP;

Shigemi Chimura, Kyoto, JP;

Toyokazu Komuro, Kyoto, JP;

Assignee:

Rohm Co., LTD, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 1/906 ;
U.S. Cl.
CPC ...
G06K 1/906 ;
Abstract

A highly rigid ceramic frame ( ) is embedded in a layer of a core member ( ). An IC chip ( ) is held inside ( ) via an elastic member ( ). IC chip arranged inside ( ) will not be greatly deformed even when a strong bending, torsional, or pressing force is applied to the IC card ( ). An impact, when exerted on the IC card ( ), will not be directly conveyed to the IC chip ( ). A coil ( ) formed by printing and the like is provided at an upper end face ( ) of the ceramic frame ( ). The coil ( ) is connected to the IC chip ( ) by a wire ( ). By forming the IC chip ( ), the ceramic frame ( ) and the coil ( ) integrally in advance, the workability in fabrication is improved. Therefore, a circuit chip mounted card of high reliability and low fabrication cost can be provided.


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