The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2002

Filed:

Dec. 21, 1999
Applicant:
Inventors:

Srinivas Tadigadapa, Ann Arbor, MI (US);

Chialun Tsai, Ann Arbor, MI (US);

Yafan Zhang, Ann Arbor, MI (US);

Nader Najafi, Ann Arbor, MI (US);

Assignee:

Integrated Sensing Systems, Inc., Ypsilanti, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01F 1/80 ;
U.S. Cl.
CPC ...
G01F 1/80 ;
Abstract

Micromachine fluidic apparatus incorporates a free-standing tube section and electrodes to actuate or control the movement of the tube section, or to sense the movement of the tube section, or both. Electronic circuitry, which may be disposed on the same substrate as the fluidic portion of the apparatus, is used in conjunction with the tube and electrodes in conjunction with a variety of different applications, including fluid flow measurement, fluid density measurement, fluid viscosity measurement, fluid transport, separation and/or mixing. According to a particular embodiment, the free-standing section of the tube is resonated for fluid flow and density measurements according to the Coriolis effect. Capacitive/electrostatic actuation techniques are used to control or resonate the free-standing section of the tube, and to detect variations in tube movement. Different methods of fabricating micromachine fluidic apparatus are also disclosed, including the use of fusion bonding of non-conducting substrates, high-aspect ratio etching techniques, and anisotropic etching and refill techniques, preferably utilizing chevron-shaped slit openings to fabricate microtube sections.


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