Implantable medical device having flat electrolytic capacitor with miniaturized epoxy connector droplet

Abstract

Implantable medical devices (DMDs) and their various components, including flat electrolytic capacitors for same, and methods of making and using same, particularly a simplified, miniature capacitor connector block and wiring harness utilizing an epoxy droplet and method of making same are disclosed. An electrode stack assembly and electrolyte are located within the interior case chamber of a hermetically sealed capacitor case. The electrode stack includes a plurality of capacitor layers stacked in registration upon one another, each capacitor layer including a cathode layer having a cathode tab, an anode sub-assembly comprising at least one anode layer having an anode tab, and a separator layer located between adjacent anode and cathode layers, whereby all adjacent cathode layers and anode layers of the stack are electrically insulated from one another by a separator layer. Anode terminal means extend through the capacitor case side wall for electrically connecting a plurality of the anode tabs to one another and providing an anode connection terminal at the exterior of the case. Cathode terminal means extend through or to an encapsulation area of the capacitor case side wall for electrically connecting a plurality of the cathode tabs to one another and providing a cathode connection terminal at the exterior of the case. A connector assembly is electrically attached to the anode connection terminal for making electrical connection with the anode tabs and to the cathode connection terminal for making electrical connection with the cathode tabs. A connector block is formed of an epoxy droplet adhered to the encapsulation area of the capacitor side wall surrounding and encapsulating the anode and cathode connection terminals and the electrical connections with the connector assembly. The connector block is formed on an encapsulation area of the case side wall of epoxy that is cured for a period of time under elevated temperature conditions while rotating the capacitor assembly.