The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2002

Filed:

Mar. 05, 2001
Applicant:
Inventors:

Akio Hidaka, Miyazaki, JP;

Katsumi Sasaki, Miyazaki, JP;

Sumio Tate, Fukuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/00 ; H01G 4/228 ; H01G 2/20 ;
U.S. Cl.
CPC ...
H01G 4/00 ; H01G 4/228 ; H01G 2/20 ;
Abstract

The present invention aims at providing an electronic component that can be readily reduced in size. Further, even when the electronic component is reduced in size, the miniaturized electronic component has (i) a wide range in capacitance, (ii) is allowed to be produced easily, (iii) has excellent electrical characteristics and (iv) can prevent defects due to a poor connection between the electronic component and a circuit board caused by warpage of the circuit board and the like when the electronic component is connected to the circuit board. The electronic component includes a capacitor element with a pair of lead terminals and an exterior packaging material disposed so as to encapsulate the capacitor element. The maximum length of the exterior packaging material is 7.5 mm or less and the maximum length of the capacitor element is 5.5 mm or less. Capacitance C of the capacitor element satisfies an inequality of 4 pF≦C≦4700 pF and a DC break down voltage BDV satisfies an inequality of BDV≧4.5 KV. The smallest spacing between the pair of lead terminals ranges from 3.0 mm to 6.0 mm.


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