The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Jul. 31, 2000
Applicant:
Inventors:
Nannaji Saka, Cambridge, MA (US);
Jamie Nam, Ninilchik, AK (US);
Hilario L. Oh, Rochester Hills, MI (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 1/114 ; B24B 4/900 ;
U.S. Cl.
CPC ...
G01B 1/114 ; B24B 4/900 ;
Abstract
A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.