The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
May. 26, 2000
Masumi Nakamichi, Tenri, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A high frequency module is provided with a resistor array layer with interconnections, in which a plurality of resistor elements having a prescribed resistance value are formed as an array, and in which an interconnection pattern for providing electrical connection to each resistor element is formed in advance. Additionally, a capacitor array layer with interconnection in which a plurality of capacitor elements having a prescribed capacitance value are formed as an array and an interconnection pattern for providing electrical connection to each capacitor element is also formed in advance for later use. A desired circuit constant is obtained by providing interconnections among the plurality of resistor elements and among the plurality of capacitor elements, respectively, in any given combination by simply modifying the respective interconnection patterns instead of the entire module. With this configuration, a high frequency module of a more compact and lighter type which facilitates design modification is provided at a low cost.