The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Jun. 07, 2000
Shohei Okazaki, Tokyo, JP;
Yoshihiro Matsumoto, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a chip-size package, an insulator tape is formed with a conductive wire having a wider section which is greater in width than other sections of the wire and a conductive bump connected to the wider section of the wire. The insulator tape is further formed with a first plurality of slits arranged on one side of the wider section of the wire and a second plurality of slits arranged on the other side of the wider section. An integrated circuit chip is provided having a conductive pad connected to the copper bump.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile