The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Jun. 28, 2001
Applicant:
Inventor:
Melissa Siow-Lui Lee, San Jose, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/100 ; H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/100 ; H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A circuit assembly is formed with a polyimide coated lower SRAM die and an upper die resin bonded to the SRAM die. The repair access opening in the polyimide coating on the upper surface of the SRAM die is filled with polyimide for protection before attaching the upper die to the SRAM die. Embodiments of the present invention including positioning a solid piece of polyimide within the repair access opening or spraying a thin coating of polyimide over the opening and on the first polyimide coating.
Lee, Melissa Siow-Lui. (2002). Stacked sram die package (U.S. Patent No. 6476475). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6476475
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile