The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
May. 26, 1999
Tomoya Kaneko, Tokyo, JP;
Kenzo Wada, Tokyo, JP;
NEC Corporation, , JP;
Abstract
A package substrate has a high frequency transmission line, which is formed by a high frequency circuit layer formed on the surface, a grounding layer formed thereunder and a dielectric ceramic intervening between the layers and , and also has a plurality of MMICs A lid as a shielding member which electromangetically shields the high frequency transmission line and the MMICs from one another, is bonded to the surface of the package substrate The lid has recesses formed such as to face the high frequency transmission line and the MMICs The surface of the package substrate and the outer periphery of the lid are hermetically sealed together by water-resistant resin. Thus, a step of bonding a shielding member is simplified and the yield of hermetic sealing of the bonded part of the shielding member is improved.