The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
May. 31, 2000
Tetsuro Ide, Shizuoka-ken, JP;
Takashi Ishii, Shizuoka-ken, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
In a joining method of first and second conductive members together, at least one of the first and second members is a covered wire having an outer periphery of a conductor wire portion covered by a resin-made covering portion, first, connection portion of the first and second members are pinched between resinous chips. At least a part of the conductor wire portion of the covered wire is covered beforehand by a low-melting-point metal layer having a significant value of thickness. Next, the covering portions corresponding to the connection portions are eliminated by heating and pressurization. And both of the resinous chips are then welded to each other, whereby the connection portions are hermetically sealed. The first and second members are electrically conductively connected together by the welding of the low-melting-point metal layer.