Joining method of covered wire, and covered wire with low-melting-point metal layer therein

Abstract

In a joining method of first and second conductive members together, at least one of the first and second members is a covered wire having an outer periphery of a conductor wire portion covered by a resin-made covering portion, first, connection portion of the first and second members are pinched between resinous chips. At least a part of the conductor wire portion of the covered wire is covered beforehand by a low-melting-point metal layer having a significant value of thickness. Next, the covering portions corresponding to the connection portions are eliminated by heating and pressurization. And both of the resinous chips are then welded to each other, whereby the connection portions are hermetically sealed. The first and second members are electrically conductively connected together by the welding of the low-melting-point metal layer.