The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Aug. 24, 2000
Tomoyoshi Murakami, Ichihara, JP;
Yutaka Tsubokura, Ichihara, JP;
Shigemasa Suzuki, Ichihara, JP;
Satoru Kinouchi, Ichihara, JP;
Idemitsu Petrochemical Co., Ltd., Tokyo, JP;
Abstract
Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.