The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Aug. 14, 2000
Takashi Hosaka, Chiba, JP;
Seiko Instruments Inc., , JP;
Abstract
A semiconductor device, such as an IC package, having the same size as an IC chip and having improved qualities is manufactured at a low cost by a particular manufacturing method. The semiconductor device has stepped-projection bumps bonded to electrode pads on a semiconductor substrate in which a semiconductor element is formed. A column portion and a portion in a horizontal portion of each stepped-projection bump are exposed while the other portion of the bump is covered with a protective material. When windows of the protective material corresponding to the column portions are formed, the windows are patterned by using a masking material based on a photoetching method, and the protective material is removed by etching.