The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Aug. 15, 2001
Kazushi Hatauchi, Hyogo, JP;
Haruo Shimamoto, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device of the present invention includes a semiconductor chip with bumps on a surface, and an adhesion sheet on the surface of semiconductor chip. The adhesion sheet has a film base material layer and a film adhesion layer for adhering the film base material layer to the semiconductor chip, and a part of the sheet melts upon heating and tears in response to pressure applied during flip chip bonding. Therefore, it is possible to obtain a semiconductor device which enables good flip chip bonding without any gaps between a device and a substrate in a simple manufacturing process, and to manufacture the semiconductor device.