The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Nov. 16, 2001
Applicant:
Inventors:
Toshiaki Yamaguchi, Tokyo, JP;
Noriyuki Kubota, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/704 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/704 ; B23K 3/102 ;
Abstract
A wire bonding apparatus, which realizes a reduction in weight and inertia of a bonding arm and which allows high-speed Z-axis swinging, is disclosed. The wire bonding apparatus comprises a bonding head fixed to an X-Y stage a bonding arm swinging in the Z-axis direction around a bonding head swinging shaft a pair of wire clamp portions and , and an actuator for driving at least one of wire clamp portions and . At least, one portion of the actuator is provided on the bonding head fixed onto the X-Y stage so as to be spaced apart from the bonding arm whereby a reduction in the weight and inertia of the bonding head is achieved.