The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Feb. 12, 2001
Applicant:
Inventor:
Stefan Kaufmann, Lenzburg, CH;
Assignee:
ABB Schweiz AG, Baden, CH;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract
A cooling device for a high-power semiconductor module has a cooler lower part ( ) and a cooler upper part ( ), with the cooler upper part ( ) being connected to the cooler lower part ( ) by an integral material connection. The cooler upper part ( ) has a cooling plate ( ) composed of metal matrix composite, for at least one semiconductor component ( ) to be fitted to. A metal border ( ) is integrally formed on the cooling plate ( ) in order to allow an integral material connection between the cooler upper part ( ) and the cooler lower part ( ). This results in a cooling device which can be produced easily and whose cost is low.