The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2002

Filed:

Jan. 30, 2001
Applicant:
Inventors:

Fumihiko Taniguchi, Kawasaki, JP;

Akira Takashima, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

In a semiconductor element stacking structure, each electrode of each of the stacked semiconductor elements can be drawn out with a simple structure. A plurality of semiconductor elements are arranged in a stacked state, each of the semiconductor elements having a circuit forming surface on which electrodes are formed. A resin layer is formed on the circuit forming surface of each of the semiconductor elements. The resin layer has an outer configuration the same as that of each of the semiconductor elements. A plurality of bonding wires are embedded in the resin layer. One end of the each of the bonding wires is connected to respective one of the electrodes and the other end of each of the bonding wires is exposed on a side surface of the resin layer.


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