Support structure for electronic component

Abstract

A support structure of a piezoelectric vibrator greatly increase a bonding strength between a conductive bonding agent and a mounting substrate. The support structure may be provided in a piezoelectric transformer, a piezoelectric vibrator, a gyroscope, and a multilayered piezoelectric component. The mounting substrate has first to third terminal electrodes provided on both top and bottom surfaces thereof and includes first to third through holes being provided at a central portion of the terminal electrodes, respectively. After the piezoelectric transformer element is positioned on the mounting substrate such that the transformer element is spaced slightly apart from the top surface of the mounting substrate by a predetermined distance, a conductive bonding agent is applied to the node N of vibration of an input electrode of the piezoelectric transformer element and the first terminal electrode, and the first through hole is filled with the conductive bonding agent. Similarly, the conductive bonding agent is applied to an output electrode and the second terminal electrode of the piezoelectric transformer, and the third through hole is also filled with the conductive bonding agent.