The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
May. 25, 2001
Hisashi Wakako, Aichi, JP;
Masahiro Iba, Aichi, JP;
Kazuhisa Sato, Aichi, JP;
Kazuo Kimura, Aichi, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A printed-wiring substrate has main-face-side connection terminals for solder-bonding to connection terminals of an IC chip on a main face A thereof and back-face-side connection terminals for connecting, through mechanical contact, to connection terminals of a motherboard on a back face B thereof. The surface of each of the main-face-side connection terminals is covered with a main-face-side displacement Au plating layer having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals is covered with a back-face-side displacement Au plating layer , which is thicker than the main-face-side displacement Au plating layer and has a thickness of 0.2 &mgr;m or greater.