The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Feb. 09, 2001
Sadao Nakayama, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The present invention provides a semiconductor device of the BGA configuration comprising: a wiring layer arranged on a circuit substrate via an insulation layer; a land metal portion formed on the wiring layer ; a solder resist layered so as to cover the land metal excluding a center portion thereof and the entire surface of the circuit substrate ; and a solder ball arranged on the land metal portion defined and surrounded by the solder resist ; wherein the land metal portion has a solder ball contact surface having a groove (or a line-shaped protrusion) extending continuously.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile