The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Oct. 06, 2000
Applicant:
Inventors:
Norihiro Inagaki, Hamamatsu, JP;
Shigeru Tasaka, Shizuoka, JP;
Assignee:
President of Shizuoka University, Shizuoka, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/508 ;
U.S. Cl.
CPC ...
B32B 1/508 ;
Abstract
Provided is a thin copper film directly bonded polyimide film in which a thin copper film is directly and strongly connected to a polyimide film. This thin copper film directly bonded polyimide film includes a polyimide film modified by bonding an organic silane compound having a cyano group represented by formula —Si(R—CN) (wherein R represents alkyl group having 1 to 6 carbon atoms and n represents a positive number from 1 to 3) to a carbon atom on the surface of the polyimide film, and a thin copper film directly bonded to the modified surface of the polyimide film.