The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Nov. 04, 1999
Applicant:
Inventors:
Barry Jay Thaler, Lawrenceville, NJ (US);
Ashok Narayan Prabhu, East Windsor, NJ (US);
Assignee:
Sarnoff Corporation, Princeton, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 2/900 ;
U.S. Cl.
CPC ...
C03B 2/900 ;
Abstract
A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.