The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2002

Filed:

May. 25, 2000
Applicant:
Inventors:

Tomohiro Nakano, Fujisawa, JP;

Akira Kaneshige, Kanagawa, JP;

Kiyoshi Adachi, Hiratsuku, JP;

Assignee:

Molex Incorporated, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/200 ;
U.S. Cl.
CPC ...
H01R 1/200 ;
Abstract

An IC socket has a socket body with a plurality of terminal mounting holes, and terminals of electrical connector mounted in the terminal mounting holes and each of the terminals of electrical connector having a contact portion, a spring portion and a tail portion for performing a burn-in test of an IC package by mounting the IC package on the socket body so as to place a solder ball as a contact of the IC package corresponding to the contact portion and contacting the contact portion with the solder ball. The spring portion of each of the terminals of electrical connector is formed into meandering shape as a whole by stacking a plurality of r-shaped portions in series with alternately orienting each r-surface thereof in the opposite direction from the contact portion toward the tail portion. The contact portion of each of the terminals of electrical connector has a pair of contact pieces on both sides of a recess portion, and horizontal stepped portions projected from opposite sides at generally intermediate portion of generally V-shaped portion formed by oblique contact end faces of the pair of contact pieces and formed with edged portions at the tip end thereof, the lower portion of the solder ball being supported in contact by the horizontal stepped portions and the edge portions.


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