The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2002

Filed:

May. 15, 2000
Applicant:
Inventors:

Minoru Hirata, Toyokawa, JP;

Yutaka Hadano, Toyokawa, JP;

Assignee:

Singtokogio, Ltd., Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22C 1/528 ;
U.S. Cl.
CPC ...
B22C 1/528 ;
Abstract

A method and system using a molding apparatus with frames by which the amount of molding sand that overflows the molding apparatus and that must be taken out of a mold that is prepared by a molding operation is minimized, and by which the density of the mold within a frame is substantially uniform. The molding sand filling cavity is defined by a pattern plate, a molding frame that can be put on the pattern plate, a filling frame that can be put on the molding frame, and a covering apparatus having a plurality of squeezing feet. The squeezing feet can enter the filling frame and can be temporarily held at certain positions where certain distances are kept between the lower ends of the squeezing feet and surfaces of the patterns on the pattern plate that are opposed to the lower ends. Molding sand is supplied to the molding sand filling cavity. Then, the molding sand is compressed by the squeezing feet.


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