The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2002

Filed:

Jun. 20, 2001
Applicant:
Inventors:

Barry T. Neyer, Cincinnati, OH (US);

Robert Tomasoski, Centerville, OH (US);

Robert Tetreault, Pointe-Claire, CA;

George Papadopoulos, Dollard Des Ormeaux, CA;

Assignee:

PerkinElmer, Inc., Wellesley, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F42B 3/10 ;
U.S. Cl.
CPC ...
F42B 3/10 ;
Abstract

A chip slapper including a substrate, a sticking layer on the substrate, a conductive layer on the sticking layer in the shape of two lands separated by a bridge portion between the two lands, a buffer material on the conductive layer, a protective coating on the buffer layer extending across at least a substantial portion of the two lands but absent from the bridge portion, and a flyer layer over the bridge portion. The buffer layer prevents migration of the material of the coating into the material of the conductive layer and vice versa and better adheres the flyer layer on the bridge portion where the coating is absent.


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