The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
May. 19, 2000
Katsunori Wada, Tokyo, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing an aluminum-stabilized superconducting wire, which comprises the step of hot-extrusion-coating an entirety or a part of an outer circumference of a superconducting wire ( ) which includes a superconducting filament embedded in a copper or copper alloy matrix, with a stabilizer ( ) made of a precipitation-type aluminum alloy, is provided. The precipitation-type aluminum alloy is an Al—Ni alloy containing 100 to 25000 ppm of Ni, and the stabilizer made of the precipitation-type aluminum alloy is subjected, prior to the hot extrusion coating step, to an aging-heat treatment in which it is heated at a temperature of 250° C. to 500° C. for 10 minutes or more.