The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Feb. 15, 2000
Samuel Alan Johnson, Eagle, ID (US);
Mukesh P. Patel, Boise, ID (US);
Timothy V. Harper, Boise, ID (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A ball grid technology circuit assembly for mounting and connecting a ball grid array circuit package having a grid array of ball pads to a printed circuit board and providing enhanced connections for testing of the ball grid array circuits. The printed circuit board includes a via array of vias wherein each via extends from the upper face of the printed circuit board to a lower face of the printed circuit board and is co-located with a ball pad of the ball grid array to provide a path between the ball pad and the lower end of the via to provide electrical access to the corresponding ball pad. A probe array includes a pin array of probe pins wherein each probe pin is co-located with a via of the via array to provide electrical contact with a ball pad of the ball grid array. The probe array is mounted in a probe block and the probe block and printed circuit board include alignment holes and alignment pins for aligning the probe array with the vias and a probe attachment to secure the probe block to the ball grid array technology circuit assembly.