The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
May. 09, 2000
Applicant:
Inventors:
Tatsuto Nishihara, Tokyo, JP;
Masatoshi Yasunaga, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A semiconductor device has a first semiconductor chip , a wiring substrate connected to the first semiconductor chip , a first surrounding substrate which has an opening at a position avoiding the first semiconductor chip and which is connected onto the wiring substrate by flip-chip bonding, and a second semiconductor chip connected onto the first surrounding substrate by flip-chip bonding. A second surrounding substrate comprising a two or more number of substrate elements is used for the first surrounding substrate